7/17/2002 - Fujitsu Microelectronics America, Inc. (FMA) today introduced its new CS Module™, the industry’s first Chip-Size Module with system-in-package technology that can shrink a multi-chip package to the size of its largest chip.
The CS Module combines advances in wafer-thinning technology, which reduces the thickness of existing chips to about 16 percent of the original size, with chip stacking and re-distribution technologies. “The board area and profile of the CS Module are just two-thirds the size of competing products with similar capabilities,” said Dennis Stephenson, director of FMA’s Advanced Packaging Services Group. “It is the best solution for miniaturized digital equipment.”
The CS Module will be displayed at FMA’s booth (9516) at SEMICON West, July 17-19 in San Jose.
As mobile phones, PDAs and digital A/V equipment continue to shrink in size and add functions, there is an increasing demand for system solutions that deliver short development cycles. Conventional system IC design uses system-on-chip (SOC) methodology, which integrates multiple functions on a chip. The system-in-package (SiP) approach, which allows separate die wafers to be stacked on the substrate, uses existing package assembly techniques to reduce development lead times and costs.
Fujitsu's packaging technology reduces the size of conventional SiPs by fabricating thin-profile chips. The technology stacks chips into two layers and re-distributes signal circuitry between them. Leveraging these core technologies enabled Fujitsu to design a system prototype combining logic and memory functions, a key capability for high-end applications.
The CS Module includes four chips, designed for high-end applications. The modules use two logic devices placed on top of each other, along with a memory chip. The upper-stage chip spacing is at a pitch of 0.040 mm. Using 0.050 mm thick devices, the module achieves a maximum density of only 0.65 mm.
About the New Technology
Fujitsu's new packaging technology drastically reduces the size of conventional SiPs by fabricating thin-profile chips and, after stacking them into two layers, re-distributing signal circuitry between the chips. Leveraging these core technologies enabled the company to successfully design a system LSI prototype that combines logic and memory functions for high-end applications.
The new SiP combines several advanced technologies including the following:
Wafer level chip size package (CSP) processing technology - The size of a CSP is equal to, or slightly larger than. the chips housed in it. The wafer-level CSPs assembly process is completed at the wafer level. The module is comprised of a wiring formation technology for signal transmission, device-protecting passivation technology, and the external terminal formation technology needed to attach the device to the motherboard.
Ultra-thin wafer-processing technology - enables very thin wafer densities by mechanically grinding the rear face of the wafer from the standard thickness of 0.15 mm to 0.025 mm, reducing the wafer to approximately 16 percent of the original size.
High precision placement technology - permits mounting of ultra-thin chips on the wafer at a tolerance of ±0.005 millimeters, with the aid of a chip bonder.
Interchip planarization - allows re-distribution between multi-level chips by padding embedding resin in gaps between chips placed on a wafer surface, for greater planarity.
Re-distribution technology - forms fine copper circuits by exposing, developing and etching processes.
Built-in passive components technology - enables inclusion of capacitor and inductor by using re-distribution technology.
About Fujitsu Microelectronics
Fujitsu Microelectronics America, Inc. (FMA) designs, markets and supports a broad range of semiconductors and electronic devices. For product information, call 1-800-866-8608, or visit the company web site at http://www.fma.fujitsu.com/apt/main01.asp
CS Module is a trademark of Fujitsu Limited. All other product names and company names mentioned herein are the trademarks or registered trademarks of their respective firms.
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Fujitsu Microelectronics America, Inc.
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