IBM announces second generation chip packaging technology

7/16/2002 - IBM today announced its second generation Surface Laminar Circuit (SLC) "flip chip" packaging technology and collaborative efforts with Amkor Technologies, ASAT and ASE to make the technology available for a broader set of customer applications.

The new SLC packaging technology is designed to support higher performance and more complex chip designs. With growing customer demand for this technology, IBM is working with Amkor, ASAT and ASE to enable them to design, build and assemble modules using these new advanced flip chip substrates.

IBM will support these assemblers by providing substrate design services as well as electrical, mechanical and thermal modeling, all to make the technology easier to use and more widely available for customers.

"The transition to flip chip is accelerating," said Hal Lasky, director, Interconnect Products, IBM Microelectronics. "IBM's long-term experience in flip chip uniquely positions us to provide solutions for customers making that transition. Now our SLC technology is an option available to Amkor, ASAT and ASE customers as well."

IBM intends to provide the new SLC substrates based on its "build up technology" currently manufactured in Yasu, Japan. ASAT plans to provide assembly services at various facilities in Asia, while AMKOR also plans to provide assembly services at various facilities in Asia (including Taiwan, Philippines and Korea). ASE plans to provide assembly services at various facilities in Asia as well.

IBM Surface Laminar Circuit technology provides package designers and systems integrators with leading-edge interconnect solutions for a wide variety of applications, including DSPs, chip sets, graphic processor units, MPUs, as well as ASICs.

The new IBM SLC package is constructed with laser microvias and is available with advanced wiring groundrules and microvia diameters down to 48 um. The package passes 1000 cycles DTC (-55 to 125oC) and Jedec 3 preconditioning. Prototypes featuring 150 um C4 area array pitch and 212 um core pitch are planned to be available in the 4th quarter of this year.

About IBM
IBM Microelectronics is a key contributor to IBM's role as the world's premier information technology supplier. IBM Microelectronics develops, manufactures and markets state-of-the-art semiconductor and interconnect technologies, products and services. IBM makes chips for a wide range of devices from the world's most powerful computers to the smallest cell phones. Its superior integrated solutions can be found in many of the world's best-known electronic brands. More information about IBM Microelectronics can be found at:

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