TSMC 0.13-Micron Copper Process Delivers Altera's Stratix Devices In Record Time

6/17/2002 - Altera Corporation's (NASDAQ: ALTR) earlier than planned release of its first Stratix™ device family is proof positive that Taiwan Semiconductor Manufacturing Company's (TSMC) 0.13-micron copper process is now operating in high gear. Analysis of early production runs of the Stratix EP1S25 devices indicate that all process parameters are on target and that performance has exceeded expectations. This achievement was made possible by the advanced technology collaboration between the two companies, beginning in December 2001 with the first shipments of Altera's 0.13-micron APEX™ II EP2A70 devices. "Altera is among our largest consumers of 0.13-micron wafers and was instrumental in fine-tuning this process," said Genda Hu, vice president of marketing at TSMC. "Our technology development partnership and our shared goal of aggressive innovation benefit our customers who depend on us to deliver cost effective, high-performance products so they can then pass these advantages on to their customers."

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