IBM Ships 100 millionth silicon germanium chip

5/21/2002 - IBM today announced it has shipped the 100 millionth chip made with silicon germanium (SiGe), a technology pioneered by IBM that is revolutionizing the design of cell phones and other wireless electronic products. The 100 millionth SiGe chip was produced at IBM's Burlington, Vermont facility, the company's primary chip manufacturing site and exclusive IBM SiGe production facility, and was delivered to Tektronix (NYSE: TEK), a world leader in advanced test, measurement and monitoring equipment.

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