ISSI Introduces New Stacked Multi-Chip Modules for Mobile Communications Market Delivered in Fujitsuís leading-edge FBGA Packaging Technology

5/20/2002 - Integrated Silicon Solution, Inc. (Nasdaq: ISSI), a leader in advanced memory solutions, today introduced a new family of stacked multi-chip package (MCP) Flash and SRAM memory products. The new products combine ISSI's 8Mb low-power asynchronous SRAM with Fujitsu's 64Mb or 32Mb NOR-type Flash memory in a stacked multi-chip module with fine-pitch ball grid array (FBGA).

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