Texas Instruments, IDT, and Hitachi Introduce the Next Standard in Logic Packaging for Gates and Octals

4/30/2002 - Advancing the logic industry's trend toward smaller packaging technologies, Texas Instruments (TI) (NYSE: TXN), IDT (Integrated Device Technology, Inc.) (Nasdaq: IDTI), and Hitachi (NYSE:HIT) have introduced 20/16/14 pin Quad Flat No-Lead (QFN) packaging for gate and octal bit width logic devices. Designers can take advantage of reduced form factors in personal digital assistants, cell phones, and other handheld consumer electronics, as well as in advanced networking and communications applications by using this package, which is up to 62 percent smaller compared to thin scale small outline packages (TSSOP) in the same bit widths.

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