eASIC Awarded Six Patents for Very High Density Configurable Logic Technology

4/30/2002 - eASIC Corporation, a provider of innovative configurable logic cores for System-on-Chip, today announced the award of six patents for very high-density configurable logic technology. These patents cover the concept of programmable logic cell array with mask-customized interconnection, as well as the segmented multi-layer routing fabric customized with a single mask, and additionally some unique elements of the eASIC technology.

Previous Page | News by Category | News Search

If you found this page useful, bookmark and share it on: