Texas Instruments Bundles RADVISION's SIP Technology for VoIP Gateways and IP Phones

4/10/2002 - To speed customers' time to market, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced that it will bundle RADVISION's (NASDAQ: RVSN) session initiation protocol (SIP) technology with TI's integrated silicon and software voice over Internet protocol (VoIP) for premise gateways and IP phones. This bundling enables TI customers developing enterprise IP phones, voice over IP (VoIP) residential/small office home office (SOHO) gateways and enterprise gateways to shorten and ease development time for their products. This offering expands the TI-RADVISION relationship, as TI currently offers RADVISION's H.323 and MEGACO/H.248 enabling technology with its IP phone, residential/SOHO gateway and enterprise gateway solutions.

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