IBM, Sony, SCE and Toshiba to jointly develop chip-making process technology

4/2/2002 - In a unique collaboration, IBM, Sony Corporation, Sony Computer Entertainment Inc. and Toshiba Corporation have signed a multi-year agreement to jointly develop advanced semiconductor technologies based on silicon-on-insulator (SOI) and other IBM materials advances. This will lead to the development of high-performance, low-power chips necessary for a wide range of future electronic products - - from digital consumer applications to supercomputers.

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