Celestry Design Tools Qualified for TSMC 0.13-micron Process

4/9/2002 - Celestry Design Technologies, Inc., the leading provider of Silicon Accurate Sign-offTM technology for the semiconductor and electronics industry, today announced qualification of three of its design tools for Taiwan Semiconductor Manufacturing Company (TSMC) 0.13-micron process. The qualified tools include the RelPro+TM and RelXpertTM products for Hot Carrier Injection (HCI) effects, and the AnalogXpertTM product for device mismatch simulation analysis for TSMC's analog/mixed-signal (AMS) process technologies.

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