Altera and TSMC Collaborate on Nexsys Based 90-Nanometer Process Technology for PLDs

4/22/2002 - Continuing on their commitment to innovation, Altera and TSMC today announced their technology collaboration based on TSMC's Nexsys™ technology for system-on-chip (SoC) design. The collaboration focuses on development of programmable logic devices (PLDs) at the 90-nanometer (nm) process node. This milestone marks another industry first for the two companies, extending a partnership that has already resulted in several market-leading innovations. Altera will leverage the Nexsys technology for future-generation PLDs and expects to realize a performance increase up to 30 percent as well as significant cost savings resulting from the combination of smaller die size and larger 300-mm semiconductor wafers.

Previous Page | News by Category | News Search

If you found this page useful, bookmark and share it on: