WEDC Awarded Initial Order for $1M System-On-Chip Microprocessor Modules

3/5/2002 - White Electronic Designs Corporation (NASDAQ: WEDC) has received over $1Million of contract orders for its System-On-Chip (SOC) Power PC and Ball-Grid-Array (BGA) Memory Multichip Package (MCP) products, which will be used in the latest generation air-to-air missile known as AIM-9X Sidewinder.

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