3DSP and Coware Partner to Strengthen Design Processes and High-level Verification for Multi-core DSP SOC Solutions

3/11/2002 - 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, announced that it has partnered with CoWare(TM), Inc., the leading provider of system-level design tools, to strengthen joint customers' design processes and high-level verification for multi-core DSP system-on-a-chip (SoC) solutions. This partnership entails integration of appropriate 3DSP design tools within CoWare's N2C(TM) design system, a demonstration of which is being provided in the 3DSP booth number 4652N at the Embedded Systems Conference in San Francisco, March 13- 15, 2002.

Previous Page | News by Category | News Search

If you found this page useful, bookmark and share it on: