3/5/2002 - Cadence Design Systems, Inc. (NYSE:CDN) today introduced two new products for 0.13—micron and beyond integrated circuit (IC) design, and announced three customer design wins. The new products, Cadence® SoC Encounter and Cadence First Encounter® Ultra, integrate the Cadence SP&R (synthesis/place-and-route) solution with new advanced capabilities and technology from Silicon Perspective Corporation (SPC), which was acquired by Cadence in December 2001. Cadence SoC Encounter is a complete front-to-back hierarchical IC implementation solution for large-scale system-on-a-chip (SoC) design up to 30-million gates. Cadence First Encounter Ultra provides virtual prototyping, physical synthesis, and full-chip hierarchical floorplanning and placement. Cadence has received orders and delivered the new Encounter products to key SoC customers, including Agere Systems, CoSine Communications, and Toshiba America Electronic Components, Inc. (TAEC).
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