Fujitsu Microelectronics America Introduces Industry's First Eight-Stacked Multi-Chip Package for Mobile, Digital A/V Equipment

3/25/2002 - Fujitsu Microelectronics America (FMA) today introduced in North America the industry's highest density multi-chip package, an MCP that can support as many as eight chips. Designed for mobile phones, digital audio/video equipment and IC cards, the new eight-chip MCP can meet demands for smaller, thinner, more densely integrated, high-capacity devices.

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