ChipPAC Adopts Cadence IC Packaging Design Technology for Use Worldwide

2/27/2002 - Cadence Design Systems, Inc. (NYSE:CDN), the world's leading supplier of electronic design products and services, announced today that ChipPAC, Inc. (Nasdaq:CHPC), one of the world's largest and most diversified semiconductor packaging, test and distribution providers, has standardized on the Cadence® integrated circuit (IC) packaging design suites, Advanced Package Designer and Advanced Package Engineer, to further automate its IC packaging design process and reduce cycle times. The design solutions are used to support all of ChipPAC's advanced IC packages including Ball Grid Array (BGA), Chip Scale (CSP), and Flip Chip.

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