2/25/2002 - 3DSP Corporation, the leader in configurable digital signal processor (DSP) architectures, now offers an advanced IP-based development platform for multi-protocol Wireless LAN (WLAN) ICs - an industry first. Using this design, licensees will be able to quickly develop advanced SoCs capable of supporting up to three different Wireless LAN modulation/demodulation schemes in parallel. Now, a single IC can be implemented that enables wireless Access Points to support different WLAN network protocols simultaneously, for example accepting both IEEE802.11a and IEEE802.11b data streams at the same time. This multi-channel operability can also be used to accept multiple data streams of the same protocol simultaneously to increase data throughput over a WLAN to any Access Point.
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