Fujitsu Introduces High-Capacity Four-Stacked MCP and Two-Stacked MCP for Package Standardization

2/20/2002 - Fujitsu Microelectronics America, Inc. today introduced the industry's first four-stacked multi-chip package (MCP), the MB84VZ064A. The new MCP is equipped with a pair of 64 Megabit NOR dual-operation flash memory chips and 32 Megabit mobile Fast Cycle RAM (FCRAM(TM)) with an asynchronous SRAM interface and 8 Megabit SRAM.

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