DSPC Technologies Selects TI's Wireless Processing Platform with TI- Enhanced ARM9 to Enable High Performance PDC and Multimedia Applications

2/22/2002 - In a move to bring enhanced multimedia and Java applications to the new generation of Japanese mobile devices, DSPC Technologies, an Intel company, has chosen a wireless processing platform from Texas Instruments Incorporated (NYSE:TXN) (TI) to power DSPC's next generation of single chip baseband solutions for the Japanese Personal Digital Cellular (PDC) market. TI will provide a 2.5G and 3G application platform, which will be coupled with DSPC's architecture features and baseband technology to deliver the high performance and low power necessary for mobile users to experience richer Java applications, 3D graphics, video playback and gaming.

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