GHz ZIF Socket for 1 mm Pitch, 40 mm Body, 35 Watt BGA IC

12/5/2002 - Ironwood Electronics’ new high performance solderless SG-BGA-6072 Socket allows 35 watt BGA IC’s to be socketed and operate without compromising performance in very high speed communication or computing applications. The new 6.5 GHz bandwidth sockets easily support very dense BGA devices utilizing a high performance conductive elastomer contactor. The socket is a precision device, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink to provide compressive force. The socket shown in the picture is a 40 mm body size SG-BGA-6072. The SG-BGA-6072 accommodates IC packages with 1.0 mm pitch, 39X39 array. A typical IC package is an Advanced Interconnect Technologies FC1041MK. An integral aluminum finned heatsink is designed to dissipate up to 35 watts. The heatsink also provides access for a thermocouple to measure IC temperature.

These patent pending ZIF sockets are simply mechanically mounted to the target PCB. The sockets are 5 mm high and only 2.5 mm per side larger than the actual IC packages, minimizing footprint on system boards while maximizing system speeds. A backing plate on the opposite of the board is required to maintain connection stability. An insulator plate that allows spacing for backside capacitors and other components can be easily customized for any configuration.

Pricing for the socket SG-BGA-6072 is $991 at quantity 100.

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