QUALCOMM Licenses USB On-The-Go Technology from TransDimension for 3G Chipsets

11/13/2002 - QUALCOMM, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, and TransDimension, a privately held company that develops and markets connectivity solutions based on Universal Serial Bus (USB) and BluetoothTM technologies, announced the licensing by QUALCOMM of TransDimension's USB On-The-Go (OTG) technology.

USB is a serial interface that allows communication between hosts such as PCs and peripherals. As more portable devices adopt the USB interface, direct connectivity - without a PC as an intermediary - has become a necessity. The OTG Supplement to the USB 2.0 Specification defines several enhancements that address the growing need for mobile connectivity, including a USB peripheral with host capability to communicate with other selected USB peripherals, a mobile-form-factor USB connector, and low-power capabilities to preserve battery life. Wireless handsets using QUALCOMM chipsets that incorporate the OTG technology will enable access to a multitude of existing USB devices - including accessories such as printers, digital cameras, keyboards, audio players and CD-ROMs.

"QUALCOMM is committed to providing our customers with the most cost-effective and highly integrated 3G wireless solutions in the industry," said Don Schrock, president of QUALCOMM CDMA Technologies. "Partnering with TransDimension and integrating its complete OTG solution into QUALCOMM products will enable a new generation of connectivity between leading-edge third-generation (3G) wireless terminals and numerous USB devices."

"We are proud QUALCOMM has chosen our technology to bring innovative new connectivity features like OTG to their next-generation chipsets," said Rick Goerner, CEO of TransDimension. "We were able to offer the industry's most complete OTG solution, consisting of our USB OTG Controller IP Core, USBLink OTG software and class drivers, and we are pleased that QUALCOMM is making it part of their overall connectivity solution."

Headquartered in Irvine, Calif., TransDimension is a privately held company founded in 1997 to develop and market embedded and mobile connectivity solutions based on intelligent USB and BluetoothTM technologies. TransDimension's product lines include integrated circuits, optimized Intellectual Property (IP) cores, software stacks and development tools that enable direct wired and wireless interconnectivity and I/O for a wide range of embedded applications and mobile devices that until now have required an indirect means, such as a PC host, of exchanging data. SoftConnex, an independent subsidiary of TransDimension, delivers a complete software solution for the USB embedded market. Their flagship product, USBLink Host, provides the broadest platform support and the largest library of class drivers available for the embedded market.

QUALCOMM Incorporated is a leader in developing and delivering innovative digital wireless communications products and services based on the Company's CDMA digital technology. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and traded on The Nasdaq Stock Market® under the ticker symbol QCOM.

QUALCOMM is a registered trademark of QUALCOMM Incorporated. Bluetooth and the Bluetooth logos are trademarks owned by Bluetooth SIG, Inc., U.S.A.

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