10/21/2002 - Fujitsu Limited and Amkor Technology have ended discussions relating to making Kyushu Fujitsu Electronics Ltd., Fujitsu's wholly owned semiconductor assembly and test operation located in Kagoshima, Japan, a joint venture. Fujitsu and Amkor had signed a non-binding memorandum of understanding in April 2002 aiming for the joint venture to commence operations in the second quarter of this fiscal year, and they were in negotiations on a definitive agreement.
Subsequently, after extensive negotiations regarding the details of the proposed venture, and taking into account various factors including economic aspects and industry environment, both companies concluded that the transaction proposed by the MOU was not feasible and therefore decided to discontinue further discussions.
Kyushu Fujitsu Electronics currently provides assembly and test services to Fujitsu Limited and more than 20 third-party customers using a variety of leading-edge package technologies, including bump chip carrier (BCC) and stacked multi-chip packages (S-MCP), which incorporate as many as eight die per package. The company will continue to develop its business as a leading edge, high-quality semiconductor back-end test and assembly facility for the Fujitsu Group.
Fujitsu is a leading provider of customer-focused IT and communications solutions for the global marketplace. Pace-setting technologies, high-reliability/performance computing and telecommunications platforms, and a worldwide corps of systems and services experts make Fujitsu uniquely positioned to unleash the infinite possibilities of the broadband Internet to help its customers succeed. Headquartered in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated revenues of 5 trillion yen (about US$38 billion) for the fiscal year ended March 31, 2002.
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