10/7/2002 - 3DSP, the leader in configurable digital signal processor (DSP) architectures, announced that it has partnered with Synopsys Professional Services to provide certified design centers for 3DSP's digital signal processing cores. As part of the agreement, 3DSP will provide Synopsys Professional Services access to their DSP core technology and training, thereby enabling more optimal system-on-chip (SoC) implementations for mutual customers. Having certified design centers will enable both companies to independently offer developers a complete, integrated system-on-chip solution for signal processing intensive applications.
"We are thrilled to be working with one of the premier design services providers to offer customers complete design solutions with 3DSP's state-of-the-art cores," said Duane Smith, vice president of marketing and operations at 3DSP. "As a certified design center, Synopsys Professional Services will be able to assure our customers of an efficient and proven work flow in performing the synthesis and layout on our cores."
"3DSP's high-performance DSP cores are an excellent addition to the wide variety of 'star' IP supported by our design centers," said Glen Jones, director of strategic partnerships, Synopsys Professional Services. "Our mutual customers will be able to leverage our proven design flows and experience with integrating complex IP into advanced SoCs."
Synopsys Professional Services is a global provider of consulting and turnkey design services delivering the technology, methodology and expertise to solve the most demanding ASIC and SoC development challenges. Synopsys' comprehensive portfolio of services covers all critical phases of the design process, as well as systems development in wireless and broadband applications.
3DSP offers the industry's only fully configurable digital signal processing architecture with a comprehensive object-oriented design environment and application-based intellectual property. 3DSP's technology empowers system designers to create custom SoC solutions in silicon that achieve significant competitive advantages in performance, integration, power consumption, cost and time-to-market for tomorrow's multimedia, wireless and Voice over Packet applications.
3DSP Corporation and 3DSP are trademarks of 3DSP Corporation.
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