Altera and TSMC Deliver Industry's First 0.13-Micron All-Copper Interconnect PLD

1/7/2002 - Altera Corporation (Nasdaq: ALTR) and Taiwan Semiconductor Manufacturing Company (TSMC) today extended their industry leadership by delivering the first programmable logic device (PLD) built on a 0.13-micron semiconductor fabrication process using copper for all layers of metal interconnect. Developed in partnership with TSMC, the world's largest independent semiconductor foundry, Altera's APEX II EP2A70 device is built on the most advanced semiconductor process technology available.

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