IDT Announces Plans to Consolidate Wafer Fab Production

1/9/2002 - IDT (Integrated Device Technology, Inc., Nasdaq: IDTI), a leading communications IC company, today announced it will consolidate its wafer fabrication (fab) manufacturing operations into the Company's Hillsboro, Ore. manufacturing facility by the second half of 2002. The move reflects the continued evolution of IDT's manufacturing efforts toward the higher process technologies required for its next-generation products. IDT's manufacturing consolidation plans will include the closure of its Salinas, Calif. fab, affecting approximately 260 manufacturing and related support positions. The SRAM, multi-port and IP co-processor business groups, which occupy office space at the Salinas facility and employ approximately 90 people, will not be impacted by the fab's closure and are expected to remain located in the Salinas area.

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