eASIC Completes Tapeout of 0.13 micron Configurable Platform

1/28/2002 - eASIC Corporation today announced that it has completed tapeout of its 0.13 micron platform with embedded configurable logic and support modules. The 25mm2 platform design includes an array of 24 eASICore® blocks providing 1.2 million gates of configurable logic, 1Mbit of configurable SRAM, via-configurable I/O pads (eI/Os) and system controller to support arrays of eASICore modules. The eASICore product is licensable silicon IP aimed at providing SoC and ASIC designers with a cost-effective and fast-turn solution to cope with today's deep submicron design challenges.

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