1/28/2002 - Bustronic, a manufacturer of switch fabric architecture backplanes, and parent company Elma Electronic, a manufacturer of advanced chassis platforms, continued to show their industry leading innovation by displaying an AdvancedTCA (PICMG 3.x) development chassis at the 2002 Bus and Board conference held in Long Beach on January 21st and 22nd. Bustronic and Elma have been actively participating in defining the PICMG 2.16 and 2.17 specifications and continue their support of fabric-based systems as subcommittee members for the emerging PICMG 3.x specification. This new series of specifications for next-generation telecom equipment is "aimed at further expanding the market, for off-the-shelf, modular solutions for the communications industry."
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