Manufacturers, Foundries News
- MEMSCAP Ships Over Two Million Wafers to Knowles Acoustics
- Accent Design Services to Speak at International Fabless Forum
- AnalogIP USB2.0 PHY Ready for License on Multiple Fab Processes
- SMIC Deploys Synopsys' Proteus OPC Software for 130 Nanometer Node
- Xilinx Invests in Chinese Foundry He Jian Technology
- Mentor Debuts Technology Design Kit for SMIC 0.18 Mixed-Signal Process
- UMC Validates Calibre xRC Parasitic Extraction Solution for 90nm Process
- Future Horizons Expects IC Manufacturing Capacity Utilization to Rise
- UMC Wafer Foundry Offers Actel's Industry-Leading Space-Flight FPGAs
- Renesas Restructures by Closing Manufacturing Company in Germany
- SOPRA Licenses IMEC's Ellipsometric Porosimetry Technology
- TI Researchers Reduce Chip Power Consumption and Increase Performance
- Magma Validates Parasitic Extraction on UMC's 0.13-micron Processes
- TSMC Ships Stratix II EP2S60 Wafers to Altera Ahead of Schedule
- Triquint Introduces Foundry Design Kits for 7 pHEMT Processes
- Philips Completes First Silicon from 90-nm CMOS Production Line
- IMEC Opens New Nanoelectronics Laboratory
- Texas Instruments Becomes Core Member of IMEC
- Cypress Receives ISO 14001 Certification for Wafer Manufacturing
- Agere Boosts Manufacturing Yield with Virage Logic STAR Memory System
- Synopsys and TSMC Collaborate to Optimize RTL-to-Wafer Design Process
- Cadence Receives TSMC's Qualification for Encounter RTL Compiler
- Magma Blast Fusion Receives TSMC Validation for 0.13-Micron Designs
- MEMSCAP Manufactures Silicon Microphone Wafers for Knowles Acoustics
- Fujitsu, Sumitomo Form Joint Venture for Compound Semiconductor Devices
- Synopsys Validates Star-RCXT for UMC's 90 Nanometer Processes
- TriQuint Semiconductor Unveils Gallium Arsenide HBT Foundry Process
- TI to Ship 65nm Semiconductor Process Samples in First Quarter of 2005
- Lattice Selects Fujitsu to Manufacture Leading-Edge FPGA Products
- Fujitsu to Build Fab for Mass 90nm and 65nm Chip Production
- AIXTRON Joins IMEC's Sub-45 nm Research Platform as Equipment Partner
- Europe Pushes Limits of CMOS Technology with NANOCMOS Project
- Matsushita Becomes Core Partner of IMEC's Sub-45 nm Research Platform
- Aspex Selects Philips to Manufacture Linedancer Programmable Devices
- Panelview Offers AMLCD Protection with High-Volume Glass Lamination
- Virage Logic Supports DongbuAnam's First 0.13-Micron Offering
- Motorola Signs Off with Mentor Graphics TestKompress and Calibre
- SSMC to Spend $250 Million on Capacity Expansion in 2004
- Solectron Manufactures and Tests Dot Hill's Products in Hungary
- CEVA Establishes Foundry Program with UMC for DSP Cores
- Fujitsu First to Create Touch Panel with Conductive Polymer Film
- Paragon, Hitachi Offer Start-to-finish Design, Manufacturing Solutions
- WIN Enterprises Receives ISO 9001:2000 Quality Certification
- TriQuint Develops First Gallium Arsenide E-D pHEMT Foundry Process
- QXC Verifies Cadence Fire & Ice for TSMC'S 90 Nanometer Technology
- Agilent to Package, Manufacture Patented Photonic Technology for OEwaves
- Toshiba, SanDisk Expand by Building 300-mm Wafer Fabrication Facility
- Triquint, Lockheed Martin Develop Advanced Gallium Nitride Process
- Xilinx Skips 90nm Spartan-3 FPGA Redesign with Virtual Silicon SIP
- Cypress, Avnet Cilicon Take Hard Look at Soft Errors in Net Seminar
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