ASIC News
- e.DIGITAL AND PORTALPLAYER TO CO-DEVELOP DIGITAL AUDIO PRODUCTS FOR CONSUMER ELECTRONICS MANUFACTURERS
- Broadcom’s Family of High Definition Products Form the Core of EchoStar’s “Best of Show” DishPVR 921 Satellite TV Receiver
- Samsung Selects TI's Advanced Digital Audio Technology
- e.DIGITAL CORPORATION ANNOUNCES NEW OEM SOLUTION FOR MULTI-CODEC HIGH DEFINITION VIDEO DEVICES
- ATI and ANT Join Forces To Deliver Browser-based Interactive TV Chip Solution to Accelerate Time-to-Market for Manufacturers
- RF Micro Devices Begins Shipments of 802.11a Wireless LAN Chipsets
- IDT Introduces Industry's First Complete Family of Universal Line Interface Units
- Cypress Introduces Third Generation In-System Reprogrammable Clock Generators
- Broadcom’s ServerWorks Ships 10 Millionth Core Logic Chipset
- Cable Modem Gateways Using Broadcom’s Chips and Software Receive CableLabs CableHome 1.0 Certification
- 0-In Formal Verification Products Validate Complex National Semiconductor Bus Bridge Design
- RF Micro Devices Announces Production Shipments To Leading Japanese Handset Manufacturer For CDMA2000 1X Handset
- IBM ASIC technology helps power new Cray X1 supercomputer
- Fully Integrated Dual-Slot PC Card Interface Switch from TI Increases Board Space, Power Efficiency in Computing Devices
- RF Micro Devices Completes Acquisition of Resonext Communications
- TI Offers Industry's Fastest Nanopower Comparator in SOT23 for Low-Voltage Applications
- Texas Instruments Announces Eight-Port Gigabit Ethernet Transceiver With Industry's Lowest Power Consumption
- Fujitsu Microelectronics America's MBF300 Sweep Sensor Selected as Best New Electrical/Electronic Product of the Year by Design News Magazine
- Agere Systems Tapes Out 11 Million Gate System-On-Chip
- California Micro Devices Expands Industry-Leading SmartOR Power Regulator Family For PC NIC and WLAN Cards
- RF Micro Devices Announces Availability of 4 mm x 4 mm CDMA Power Amplifier Module Family
- Agilent Technologies introduces high-efficiency enhancement-mode PHEMT FET for wireless infrastructure through 6 GHz
- Wireless Control-Atmel Announces a Low Cost RF Wireless System Chip Set Targeted at the High-Growth UHF Unlicensed ISM Band
- Cypress Named Top Avnet Cilicon Supplier for 2002
- Honeywell and Cypress to Co-develop High Performance Integrated Circuit Technology for Space Computers
- Toshiba And WIDCOMM Team To Develop Embedded And PC Bluetooth Solutions
- Signia Technologies Announces Low Cost 2.4GHz Radio IC
- Microchip Technology Expands Power Management Portfolio with 120mA Regulated, Inductor-Free Charge Pump DC-to-DC Converter
- TI Announces Family of 800mA DC/DC Converters to Help Extend Battery Life in Portable, Bluetooth-Enabled Applications
- Bluetooth chipset leader is ready for 3G cellular phone market
- Texas Instruments Launches Bluetooth(TM) Starter Kit for Industry's Most Advanced, Fully Certified Single-Chip Solution
- Ericsson & National Sign Bluetooth Agreement
- Audio D/A Converter from TI Offers Industry's Highest Dynamic Range for High-End Audio Equipment
- Texas Instruments Finds Opportunity in Building Big, Fast ASICs
- Vitesse Semiconductor and Titan Logistics Announce Asia Logistics Agreement
- Agilent Technologies Introduces Industry's Smallest Hermetically Sealed Surface Mount Optical Driver Amplifier
- Kada Systems Selected by Mobicom for J2ME Enabled Mobile Phones
- Fujitsu Deploys Cadence Nanometer Analysis Technology to Achieve Timing Closure for High-end Asic Designs
- RF Micro Devices Opens Sales and Customer Support Office in Beijing
- Quake Sampling QT2021, its Second-generation Monolithic 10 Gb/s transceiver for Ethernet and Fibre Channel
- TI's High-Speed Amplifier Family Targets DSL and Video Applications
- Atmel and u-blox Jointly Announce Compact Low-Current GPS Positioning Engine Antaris with Industry's Best Performance
- RF Micro Devices Introduces Second-Generation, Quad-Band Power Amplifier Module with Integrated Power Control
- Texas Instruments Announces New Family of Wideband Fixed Gain Amplifiers With 3X Performance Increase
- TDK Semiconductor Prevails Over Silicon Laboratories In Summary Judgment Hearing
- CSR and SEMCO Sign Agreement for 1 Million Bluetooth Chips
- TDK Semiconductor Chooses TAARCOM for Silicon Valley Representation
- Cypress Introduces Pioneer Node Reference Design for LonWorks Control Networks
- iChip Plus to Support Switchable 802.11b WLAN and GPRS Functionality
- IDT Powers LAN Switch Application from China's Leading Communications Equipment Provider
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