Datasound eBox-3300MX Embedded System
The eBox-3300MX embedded system, from Datasound Laboratories, features 512MB DDR2 memory, enhanced IDE, 24 bit GPIO, AC97 audio, up to 3 serial ports, three USB 2.0 ports, 10/100 Mbps Ethernet, and built-in PXE 2.0 Network Boot function. The fanless 1GHz embedded computing box is ideal for terminal systems (OFTS), point-of-sale, digital signage, and other embedded systems applications. The eBox-3300MX is compatible with Microsoft Windows and Linux Operating System. The eBox-3300MX can be securely mounted onto desks, walls, or directly on the back of most LCD displays.
TI Windows Embedded CE 6.0 R3 BSP for OMAP-L1x, Sitara AM1x Processors
Texas Instruments rolled out Microsoft Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9 processors, Sitara AM1x ARM9 microprocessor units (MPUs) and associated evaluation modules (EVMs). The new BSPs enable developers to easily and quickly interface devices to Embedded CE. The BSPs include drivers and source code. Windows Embedded CE 6.0 R3 BSPs for OMAP-L1x and AM1x devices can be downloaded now for free.
Using System Builder for Embedded Linux System Development Webinar
The Using System Builder for Embedded Linux System Development webinar will present the current challenges of embedded Linux system development, and how these challenges are met using System Builder. Mentor Embedded Linux System Builder is the next-generation development environment for building embedded Linux systems. System Builder is a system integration tool based on the open source OpenEmbedded project.
Cadence Digital Implementation and Signoff Webinars
Cadence Design Systems is offering a series of EDA360 webinars. The digital implementation and signoff webcasts will present the latest approaches to realizing silicon, productively and profitably. The first online event, Getting Back Timing Margins: Traditional OCV Alternatives, starts today at 10am Pacific time. EDA360 supports both design creators and integrators.
Synopsys Introduces DesignWare MIPI M-PHY IP
Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, announced immediate availability of the DesignWare MIPI M-PHY IP for next-generation high-speed interfaces based on the newly ratified MIPI Alliance M-PHY specification. With this latest addition to the DesignWare MIPI IP portfolio, Synopsys is the first provider to offer a comprehensive solution of a controller and PHY IP for both the MIPI DigRF(SM) v3 (2.5G/3.0G) and v4 (4G) standards. Incorporating both standards in a mobile device brings the benefit of the faster 4G standards while preserving broad coverage by using 2.5G/3.0G as a fallback mode. The configurable MIPI DigRF V4 Master Controller and M-PHY hard macro are compliant to the MIPI Alliance specifications. Utilizing a single-vendor solution enables designers to lower the risk and cost of integrating these MIPI interfaces into baseband and application processor integrated circuits (ICs), speeding time-to-market of advanced semiconductor solutions for LTE and Mobile WiMAX.Mentor Graphics, GLOBALFOUNDRIES Publish Graphical Design Rule Manual
Mentor Graphics Corporation (NASDAQ: MENT) announced it has collaborated with GLOBALFOUNDRIES to create a facility called Graphical Design Rule Manual (GDRM) that helps IC designers rapidly debug layout design rule violations by integrating the Calibre RVE[TM] results viewing environment with GLOBALFOUNDRIES' electronic design rule manuals. With GDRM, designers using the Calibre RVE tool to correct DRC hotspots can automatically access detailed GLOBALFOUNDRIES textual and graphical reference information about the specific rules generating the violations. By providing instant access to relevant information, the solution allows designers to fix errors more quickly and reduce time to signoff.
SiliconBlue iCE65L01F-TCB81 and iCE65P04F-TCB121 FPGA Devices
SiliconBlue Technologies is offering their iCE65 mobileFPGA in two new device packages (iCE65L01F-TCB81 and iCE65P04F-TCB121). The new FPGA devices and SiliconBlue's wafer-level chip scale packages are ideal for implementing a number of features including gyros, accelerometers, and dual displays. The iCE65L01F-TCB81 and the iCE65P04F-TCB121 FPGA devices are available now in volume production.
FPGA-Based System Design with High-Speed Data Converters Workshops
Avnet Electronics Marketing Americas (EMA), MathWorks, and Texas Instruments (TI) are offering a series of workshops on digital signal processing (DSP) system design using Xilinx FPGAs with high-speed data converters. The two-day workshops will take place throughout North America. Engineers attending the workshop will receive a coupon or discount for their choice of either: $400 off an AES-V6DSP-LX240T-G Xilinx Virtex-6 FPGA DSP Development Kit or an AES-S6DSP-LX150T-G Xilinx Spartan-6 FPGA DSP Development Kit. Attendees will also receive $650 off a TI TSW4200 Dual ADC and Dual DAC Development Platform for Xilinx Virtex-6 and Spartan-6 FPGAs or any other combination of compatible TI high-speed converter EVMs.
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