VIA Technologies Introduces AMOS-3002 Embedded System
The VIA AMOS-3002 is a powerful, rugged and HD-ready industrial-class PC that combines the benefits of high performance 64-bit computing in an ultra compact system. The VIA embedded system has a certified operating temperature of -20 to 60 degrees C, vibration tolerance of up to 5Grms and a shock tolerance of up to 50G. Its fanless chassis measures 19.7cm x 10.4cm x 4.9cm (WxDxH). Optional Wi-Fi and 3G networking are available through a MiniPCIe expansion slot.
WIN Enterprises Introduces PL-60570 Embedded Box
WIN Enterprises introduced their PL-60570 embedded box. The WIN PL-60570 desktop appliance features the Intel D2500HN mini-ITX SBC. It includes the Intel Atom processor D2500, Intel NM10 Express Chipset, Intel Graphics Media Accelerator 3600, four channels of high definition audio and GbE LAN. The network appliance is ideal for small businesses and remote offices that require robust I/O, GbE Ethernet and processor solid performance. This device provides a two-year lifecycle.
STMicroelectronics Introduces STM3220G-JAVA Starter Kit
STMicroelectronics introduced the STM3220G-JAVA Starter Kit. The STM3220G-JAVA kit is a complete platform for evaluating the development of embedded applications in Java for the STM32 F2 series microcontrollers. The new Java tool includes an evaluation version of IS2T's MicroEJ Software Development Kit (SDK) and the STM32F2 series microcontroller evaluation board providing everything engineers need to start their projects. The STM3220G-JAVA Starter Kit is available now. It is priced at $349.
Cadence Adds In-Circuit Acceleration to System Development Suite, Expands VIP Catalog
Cadence Design Systems made two announcements today. First, the company developed new in-circuit acceleration based on the Incisive and Palladium XP platforms for their System Development Suite. Cadence's second announcement involved extensions to the Verification IP Catalog for acceleration and emulation that enable engineers to go beyond simulation to speed verification of large-scale SoCs, sub-systems and systems.
Dane-Elec Announces mySSD Solid-State Drives for Embedded Computing
Dane-Elec announced the new mySSD O-Series of solid-state drives. The mySSD O-Series is designed for high-threat and unpredictable environments in which durability and reliability are essential. The Flash-based SSD drives are available now. They are ideal for for mission-critical applications such as military, public safety, utility, homeland security, and mining applications as well as mobile workers in outdoor environment field services in which failure is not an option.
Texas Instruments Introduces DS90C187 FPD-Link Serializer
Texas Instruments announced their DS90C187 FPD-Link serializer. The low-power dual pixel serializer offers the industry's highest screen resolution while extending battery life in tablet computers, ebooks, laptops and portable display monitors. It reduces the size of the RGB interface between the host GPU and the Display. The TI DS90C187 LVDS serializer supports dual pixel data transmission between Host and Flat Panel Display up to QXGA 2048×1536@60Hz resolutions. The DS90C187 is available now in a 92-pin QFN package and features single 1.8V supply for minimal power dissipation. The device is priced at $3.95 in 1,000-unit quantities.
HuMANDATA Introduces EDA-301 USB-FPGA Board
HuMANDATA introduced their EDA-301 USB-FPGA board. The EDA-301 features the Altera Cyclone IV E FPGA (EP4CE15F17C8N), 5.0 V external input or USB bus power, and 56 user I/O's, which are divided into two I/O banks. The configurable PCB includes on-board oscillators, user switches and LEDs. It measures 53 mm x 54 mm, and can be easily swapped for a different FPGA/CPLD board.
Lattice Released iCE40 Los Angeles mobileFPGA in Volume Production
Eight devices in the Lattice Semiconductor iCE40 Los Angeles mobileFPGA family have been fully qualified and released into volume production. The low power LP640, LP1K, LP4K and LP8K devices, and the higher performance HX640, HX1K, HX4K and HX8K devices have been production released with 17 different device/package combinations.
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